TEAMGROUP Launches DDR5 Memory With 32GB & In-House Heatsink Technology

TEAMGROUP Launches DDR5 Memory With 32GB & In-House Heatsink Engineering science

Taiwan computer accessories and peripheral leader, TEAMGROUP, releases two new industrial memory products—an industry-standard temperature (IST) DDR5, which maintains a instance temperature between 0° to 85°C (185°F), and an industrial wide range temperature (IWT) DDR5, which maintains ambient temperatures between -xl° to 85°C (-40° to 185°F).

TeamGroup Releases DDR5 UDIMM & SODIMMs With Industrial Wide Temperature

A spokesperson for TEAMGROUP says this about their new DDR5 retentiveness models.

The specifications of our industrial DDR5 memory are 16/32GB per module, 4,800Mhz clock speed, CAS latency of 40-40-xl, with 1.1V operating voltage. It comes with on-die ECC function, which provides excellent stability and reliability, and added power direction features to employ power management ICs (PMIC).

With better onboard power command to optimize bespeak integrity and interference resistance, the new DDR5 memory requires only a low operating voltage of ane.1V, making it especially properly for low ability consumption industrial automation, medical devices, POS systems, digital signage, thin clients, and other free energy-saving or video applications. TEAMGROUP's DDR5 industrial memory product line volition be available for compatibility testing in the tertiary quarter of 2021 at the earliest and is expected to enter mass production in the 4th quarter of 2021.

Applications for the first DDR5 UDIMM and SODIMM industrial wide temperature memory products include usage in edge calculating, Net of Vehicles, servers, AI, and embedded systems. In response to the stringent demands of efficient computing in the industrial control marketplace,TEAMGROUP has been ready to launch the standard temperature DDR5 IST (TC: 0~85℃) memory series and the wide temperature DDR5 IWT (TA: -xl~85℃) memory series. The latter features sectional"Graphene-coated Copper heatsink Technology" (U.S. Utility Patent US 11,051,392 B2), which helps maintain a case temperature (TC) of 85~86℃ under an ambient temperature (TA) of 85℃, ensuring depression-latency high-speed computing. Without the heatsink, instance temperatures (TC) can reach up to 89~90℃ or more than, impairing the high functioning of DDR5 and significantly reducing the life span of ICs.

TEAMGROUP is synonymous within the industrial computing memory surface area, focusing on in-firm technologies for not but industrial employ, simply abode computing besides. Most industrial memory uses accept been for servers, AI, and other high-functioning figurer needs. With a focus on high-speed data processing and low-level latency needs, these two new retentiveness lines will cater to those businesses requiring high processing needs.

The DDR5 IWT memory showcases TEAMGROUP'south "Graphene-coated Copper heatsink Applied science", an in-house patented technology that allows for efficient example cooling under ambient temperatures, allowing for the ability to maintain information processing with low latency. This technology will proceed a longer lifespan without limiting performance.